Ranovus Announces Collaboration with Drut Technologies
Delivers Co- Packaged Optics (CPO) Solution for AI, ML and HPC Computing Clusters
Ottawa, Ontario, Canada – May 7, 2025 – Ranovus Inc., a leading provider of next- generation AI-optimized interconnect solutions, and Drut Technologies are specializing in transforming data center infrastructure through innovative, software-defined photonics solutions. Drut’s core focus is enabling highly efficient, dynamic infrastructure environments for artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC) workloads. Drut delivers the system architecture and control plane to harness the benefits of an all-photonic fabric architecture for AI computing clusters.
Drut's 2500 series, as highlighted in recent announcements (https://drut.io/01-14-2025-press-release)
enables PCIe Gen 5 servers to be directly connected to a photonic fabric with full x16 line speed of 32G per
serdes. The integration of Ranovus's ODIN® CPO optical interconnect technology enables this performance by addressing the critical bandwidth, density, and power consumption challenges associated with traditional high-speed electrical interconnects. The 2500 series is one of the first commercially available solutions using the CPO technology.
"We are thrilled to partner with Drut to bring the transformative benefits of our CPO technology to their game-changing 2500 series," said Hojjat Salemi, Chief Business Development Officer Ranovus]. "Drut's unwavering focus on pushing the boundaries of network performance aligns perfectly with our mission to revolutionize data center interconnect. Together, we are empowering the next generation of AI and hyperscale infrastructure for PCIe Gen 5/Gen 6/Gen 7 and 100Gbps and 200Gbps Ethernet
connectivity."
"Ranovus's ODIN® CPO technology is a true industry disruptor," said Bill Koss, CEO and President of Drut Technologies. "Integrating their solution into our 2500 series allows us to deliver unparalleled levels of performance and density while significantly reducing power consumption and footprint. This partnership underscores our commitment to providing leading-edge networking solutions that anticipate and exceed
the evolving needs of our customers."
This collaboration addresses the increasing demand for higher bandwidth and lower latency in modern data centers. As AI, machine learning, and other data-intensive applications become increasingly prevalent, the need for efficient, high-density, and scalable interconnect solutions continues to grow. The combined expertise of Ranovus and Drut offers a compelling solution to these challenges, enabling the creation of
powerful and sustainable data center infrastructure.
About Drut:
Drut Technologies transforms static data centers into dynamic environments through a comprehensive system architecture that shapes resources around workloads for maximum infrastructure utilization. This transformation is powered by extensive software integration across server kernels, photonic fabric components, fabric control systems, and higher-level applications, creating a cohesive ecosystem
that optimizes resource allocation.
Headquartered in Nashua, New Hampshire, Drut Technologies is revolutionizing data center architecture with its DynamicXcelerator platform, which seamlessly integrates software, hardware, and photonics specifically for AI applications. Their groundbreaking 2500 product series incorporates cutting-edge co-packaged optics (CPO) technology -one of the first commercially available solutions to do so - delivering unprecedented GPU connectivity options while addressing critical industry challenges, including low
latency, extended distance capabilities, enhanced efficiency, and improved security.
For more information, visit www.drut.io.
Contact:
Drut Technologies
Katie Martino
About Ranovus:
Ranovus has assembled a multidisciplinary team of industry experts spanning optoelectronic subsystems, lasers, silicon photonics, RF, mixed-signal ASICs, advanced packaging, high-volume manufacturing, system design, and technology commercialization. Together, we are addressing some of the most complex challenges in optical interconnects for AI/ML workloads.
Our industry-leading Odin® Co-Packaged Optics platform integrates all key analog components of an optical engine—lasers, modulators, photodetectors, drivers, transimpedance amplifiers, and control loops—into a compact monolithic Electro-Photonic Integrated Circuit (EPIC). This scalable solution is designed for Co-Packaged Optics, Near Packaged Optics, and Module applications. Ranovus delivers Application-Specific Optical Engines (ASOE) to the AI compute industry through a portfolio of highly efficient and scalable IP cores. By leveraging Multi-Wavelength Quantum Dot Laser technology and cutting-edge silicon photonics and digital integrated circuits, we are setting new industry benchmarks for power efficiency, size, and cost—accelerating the transition from copper to optical interconnect solutions.
For more information, visit www.ranovus.com or contact Valerie Bellemere.